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Perfect Hermeticity WCu Base Plate For Optical Telecommunication Transmission And Pump Laser Diode Modules

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: HCWC007
Certification: ISO9001
Place of Origin: CHINA
MOQ: Negotiation
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: As customer required
Material: tungsten copper
Density: Varied with tungsten content
CTE: 9.0
TC: 220
Application: Laser Diode Submounts
Grade: 50WCu,75WCu,80WCu,85WCu,90WCu
Price: Negotiable
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    Perfect Hermeticity WCu Base Plate For Optical Telecommunication Transmission And Pump Laser Diode Modules

    Perfect Hermeticity WCu Base Plate For Optical Telecommunication Transmission And Pump Laser Diode Modules


    Description:

    It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.


    Advantages:

    1. High thermal conductivity
    2. Excellent hermeticity
    3. Excellent flatness, surface finish, and size control
    4. Semi-finished or finished (Ni/Au plated) products available
    5. Low void

    Product Properties:

    GradeW ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    90WCu90±2%17.06.5180 (25℃) /176 (100℃)
    85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
    80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
    75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
    50WCu50±2%12.212.5340 (25℃) / 310 (100℃)



    Application:

    1.Used as high temperature resistance in electronic products and Auto-Engines. Like Computer generates vast amounts of heat, which results in the slow of speed.Tungsten alloy heat sink can solve this problem.
    2.Used in applications such as optoelectronics packages, Microwave Packages, Packages, Laser Submounts, etc.
    3.Used as heat sink pieces and encapsulation shell.
    4.Used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable Lasers.

    Product picture:


    We also offer tungsten copper carrier, tungsten copper heat sink, tungsten copper heat spreader, and tungsten copper submounts for microelectronics packages, ceramic packages, IC assembly and Butterfly packages.































    Buy Perfect Hermeticity WCu Base Plate For Optical Telecommunication Transmission And Pump Laser Diode Modules at wholesale prices
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