Heat Resistant MPPO Black Matrix Trays For Electronic PCBA Parts

Heat Resistant MPPO Black Matrix Trays For Electronic PCBA Parts

In the field of microelectronics, the international standards have been developed for the transportation, storage and protection of IC, modules and other electronic components, which usually refer to the JEDEC standard. The JEDEC (Joint Electron Device Engineering Council) tray is a common name for a standardized tray. According to the customer's different product size, the tray has different matrix design. It is usually injection molded to achieve high quality product requirements. At the same time, due to the particularity of this kind of plastic products, it can not only be reused many times, but also can be completely degraded after being damaged and discarded. The products fully comply with ROHS international environmental standards, customers do not have to worry about environmental protection.

The Details Of HN22010 Matrix Tray

HN22010 matrix tray has an outer size of 322.6*135.9*9.7mm, which is mainly made of MPPO material by injection molding. It is a widely used industrial raw material with high strength, high temperature resistance and environmental protection. According to the fixed pocket size, it is designed into the most reasonable 2*6 matrix. At the same time, the resistance value of the material surface is 1.0*10E4Ω~1.0*10E11Ω. It can effectively eliminate the static electricity on the surface of the product, so it is also known as the ESD tray in the industry.

In addition, we can also customize the tray for customers' products according to their requirements of size, color, high temperature resistance and so on. In addition to the matrix tray, we can also provide matching tray cover. The product is not only beautiful in appearance, but can do the most reasonable loading. It also can be overlap, which can effectively utilize space and increase product storage.

Application Of HN22010 JEDEC Tray

Optical Industry Military Industry

Micro and Nano Systems Embedded System

Advantages

1.Flexible OEM service: we can produce products according to customer’s sample or design.

2.Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3.Complicated workmanship: tooling making, Injection molding,Production

4.Comprehensive customer service: from customer consultation to after sales service.

5.10 years experience of OEM for USA and EU customers.

6.We have our own factory and can control quality in high level and produce products quickly and flexibly.

FAQ

Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?
Ans: Normally 5-8 days or so.

Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/