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6800W Single Phase BGA Welding Machine

Categories BGA Welding Machine
MOQ: 1unit
Price: USD 8000-9500/unit
Payment Terms: L/C, D/P, T/T, Western Union
Supply Ability: 200 units/month
Delivery Time: 5-7 working days
Packaging Details: wooden package
Product Name: BGA Welding Machine
Model No.: WDS-750
Optical alignment lens: Motor drive can move front back right left
GA size: 0.8mm-8cm
Min.chips pitch: 0.15mm
Mounting BGA weight: 1000g
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    6800W Single Phase BGA Welding Machine


    Automatic optical alignment chipsent repair machine BGA rework station WDS-750

    Specification and Feature:

    • Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
    • PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
    • Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
    • Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement
    • High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
    • Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
    • Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
    • High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
    • Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

    Technology Parameter:

    Power6800W
    Up heater power1200W
    Down heater power1200W
    IR heater power4200W(2400W control)
    Power supply(Single Phase) AC 220V±10 50Hz
    Position wayOptical lens+ Vshape holder+laser positioning
    Temperature controlHigh precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
    MaterialHigh sensitive touch screen+temperature control module+PLC+step drive
    PCB SizeMax:500×450mm , Min: 10×10mm
    Thermo-couple Ports4pcs
    Chips magnification times2-30
    PCB thickness0.5-8mm
    GA size0.8mm-8cm
    Min.chips pitch0.15mm
    Mounting BGA weight1000G
    Mounting precision±0.01mm
    Overall dimensionL670×W780×H850mm
    Optical alignment lensMotor drive can move front back right left
    Weight of machineAbout 90kg
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