ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
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....Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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8mmx5mm Low Temperature Labels 1mil White High Temperature Resistant Polyimide Label
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*, *::before, *::after {box-sizing: border-box; } * {margin: 0; } html, body {height: 100%; } body {line-height: 1.5; -webkit-font-smoothing: antialiased; } img, picture, video, canvas, svg {display: block; max-width: 100%; } input, button, textarea, ......
Chongqing Peineng Electronic Materials Co., Ltd.
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8 Layer BGA Boards Multilayer PCB Board Fr4 Fr5 Substrate Blue Solder Mask
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... Board size:2*6CM Solder mask:Blue Silk screen: White Name: 8 Layer BGA Boards Multilayer PCB With Blue Solder Mask Delivery time: 10days for sample and small&medium batch About quote:For the special of ......
ONESEINE TECHNOLOGY CO.,LTD
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High Definition Industrial Touch Screen BGA rework station HS-700
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...BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA......
Shenzhen Hansome Technology Co., Ltd.
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Metal Core Substrate Custom PCB Boards With Heavy Copper 4OZ Thickness
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Metal Core Substrate Custom PCB Boards With Heavy Copper 4OZ Thickness Parameter: Copper thickness 0.5 OZ to 7.0 OZ Copper thickness in hole >25.0 um (>1mil) Size Max. Board Size: 23 × 25 (580mm×900mm) Min. Drilled Hole Size: 3mil (0.075mm) Min. Line Width......
Shenzhen Xinchenger Electronic Co.,Ltd
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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
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... General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Bicheng Electronics Technology Co., Ltd
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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
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... General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Shenzhen Bicheng Electronics Technology Co., Ltd
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Cycling Rapid Rate TSA BGA Thermal Shock Chamber Testing
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... components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and high polymer materials. Characteristics: 1. Short...
BOTO GROUP LTD
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Electricity Circuit Component BOM Turnkey PCB Assembly BGA X Ray Inspection
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... BGA X Ray Inspection The printed circuit board is abbreviated as PCB, also known as printed circuit board, printed circuit board, etc. It is a circuit board that forms point-to-point connections and printed components on a common substrate according......
Chengdu Cesgate Technology Co., Ltd
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6oz Pcb Smt Assembly Fr4 Hasl Qfn Bga Dip Rigid
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...BGA DIP Rigid PCB Assembly PCB SMT Assembly Introduction Haina Lean Technology CO., LTD is our factory. We build amazing electronics. From prototype to production, we are entrusted to be their electronic manufacturing partner by companies small and large around the world. PCBA CAPABILITIES Layers 1 - 46 L Substrate......
Beijing Haina Lean Technology Co., Ltd
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