Direct Bond Copper DBC Ceramic Substrate , Aluminum Nitride Substrate
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Direct Bond Copper Alumina Metallized Ceramic DBC Substrate For Power Electronics Why choose us? 1. Support custom made metalized ceramic substrates, whatever, it's prototyping project, or cost down. 2. With over 15 years of OEM, ODM manufacturing ......
Jinghui Industry Limited
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Direct Bond Copper DBC Ceramic Substrate For Semiconductor Modules High Density Temperature Resistance Up To 1000°C
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Product Description: The Metalized Ceramic product is a high-quality component designed for various applications in the electronics industry. This product features a unique combination of metalized properties and ceramic material, making it a versatile......
Wuxi Special Ceramic Electrical Co.,Ltd
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DPC direct plating copper on Ceramic chips- RTSP1200-DPC
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... is Ceramic Radiating Substrate. Silver / Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditional manufacturing methods: DBC LTCC HTCC,...
SHANGHAI ROYAL TECHNOLOGY INC.
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Advanced Vacuum Brazing Furnace for AMB Bonding of Ceramic Substrates at 1200C
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... degassing sintering of high density alloys, tungsten-nickel alloys, tungsten-copper alloys, titanium alloys, magnetic materials and other rare metal materials vacuum heat treatment process. Vacuum brazing is carried out in the ......
Zhuzhou Ruideer Metallurgy Equipment Manufacturing Co.,Ltd
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Ceramic Laminates Rogers PCB Circuit Board Material Full Range DK
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...mask: Green About ceramic PCB The types of ceramic pcb substrates: high temperature fusion ceramic substrate (HTFC) low temperature co-fired multilayer ceramic (LTCC) high temperature co-fired multilayer ceramic (HTCC) direct bonding copper substrate (DBC)...
ONESEINE TECHNOLOGY CO.,LTD
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Half Round Alumina Ceramic Parts / Alumina Ceramic Blocks with Holes
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...black or customed Custom normally Surface smooth , glossy Machinable yes precision high Used ceramic substrates Alumina Ceramic Blocks consist of pure copper bonded to a ceramic substrate such as Al2O3 (Alumina), AlN (Aluminum Nitride), HPS (ZrO2 doped) or...
Dongguan Ming Rui Ceramic Technology Co.,ltd
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IRKT26/12S90 - International Rectifier - ADD-A-pakTM GEN V Power Modules
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... the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier......
Mega Source Elec.Limited
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