0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics
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Ultrathin High Quality MEMS PCB for Microphone Application:MEMS,sensor MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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