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SMT FPC TEST DIP Surface Mount PCB Assembly Services 1Oz OEM Electronics Usage

Categories SMT PCB Service
Brand Name: China chao sheng
Model Number: CSPCBA1530
Certification: ISO/UL/RoHS/TS
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: 12.23usd/pcs
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 200K/pcs per month
Delivery Time: 15-20day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Surface Finishing: HASL Lead Free
Min. Line Spacing: 3 Mil (0.075 Mm)
Layer: 12layers+ SMT + TEST + DIP
Usage: OEM Electronics
Copper Thickness: 1Oz
Solder Mask Color: Black.Red.Yellow.White.Blue.Green
Impedance Value: ± 10%
E-Test: 100%
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SMT FPC TEST DIP Surface Mount PCB Assembly Services 1Oz OEM Electronics Usage

Surface Mount PCB Assembly Services SMT FPC + SMT + TEST + DIP, SMT PCB, procurement PCB PCBA SMT PCB Service,carton packaging
Accelerated Assemblies offers the latest technical capabilities to meet your most demanding project requirements for circuit card assembly. Whether we assemble your product with BGA, Micro-BGA Surface Mount (SMT) PCBs have gained immense popularity in the recent years, owing to several beneficial features they offer. These PCBs are compact sized, and they perfectly meet the growing demand for miniature electronics. At Accelerated Assemblies, we have over 20 years of experience in delivering the highest quality SMT assembly services. In these circuit boards, the components are directly mounted on the PCBs. We utilize several fully automated equipment to accurately position the components on the PCB. Our unwavering commitment to quality has helped us deliver SMT PCB assemblies, which are known to offer consistent performance for a long time.

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

SMT Assembly Capabilities of Accelerated Assemblies

Over the years, we have improved our SMT assembly services to meet complex client requirements. The following capabilities have contributed to our growth as a leading surface mount assembly services in the US.

pcb product field:
Communication terminal, communication station, electronic communication, computer, home appliance, electrical appliance, SD card, SG card, mobile phone, computer, automobile, finance, aerospace, aviation, medical, military, led, power control power supply, industrial power supply, computer, office Equipment, digital products, computers, LCD, etc .;
fpc product field:
CD-ROM, hard disk, printer, fax machine, scanner, sensor, mobile phone, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD-ROM, medical, instrumentation, drive, automotive instrumentation, medical instrument, led light, lighting, Copper-based electronics, aviation, aviation, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

  • Component Packages: Currently, we can assemble the following component packages:
    • Ball Grid Array (BGA)
    • Ultra-fine Ball Grid Array (uBGA)
    • 0201 and larger chip-type components
    • Quad Flat Pack No-Lead (QFN)
    • Small Outline Integrated Circuit (SOIC)
    • Plastic Leaded Chip Carrier (PLCC)
    • Quad Flat Package (QFP)
    • Package-On-Package (PoP)
    • Chip-scale Package (CSP)
    • Board Sizes: We can provide the SMT assemblies in the following board sizes:
    • 2″x2″ (50.8mm x 50.8mm) min to 20″x18″ (508mm x 457.2mm) max
    • Single sided
    • Double sided
  • Fine Pitch Placement: Our fine pitch placement ability is not limited to these:
    • Leaded Minimums : .0065″ (.16mm) width /.010″ (.25mm) pitch
    • CSP/BGA Minimums: .010″ (.25mm) diameter / .021″ (.53mm) pitch
  • Standards and Compliances: Our surface mount assembly services adhere to the following standards and compliances:
    • ISO 9001:2008 certified
    • RoHS
    • ISO: 13485:2003 certified
    • MIL-PRF-55110
    • ITAR
  • High-speed Automation: We rely on the following state-of-the-art SMT lines for ensuring the fastest production in the industry.
    • Stencil Printing Machine
    • Flexible Component Placement Systems
    • Reflow Ovens
    • Rheometer ( for adhesives, solder pastes, and epoxy analysis)
    • Wave Soldering Systems
    • Acoustics Scanning Microscopes ( for crack and void checking)
    • Microscopy X-ray Inspection Machine
    • Vitronics Reflow Ovens
    • In-line Aqueous Cleaners
  • Testing and Inspection: Every PCB manufactured at our facility undergoes rigorous testing and inspection. We assure 100% AOI (Automated Optical Inspection) of Surface Mount Assemblies. We employ the following evaluation process to ensure the highest quality of the PCBs.
    • Vibration and Shock Testing
    • Scanning Electron Microscopy (SEM)
    • Cross-sectioning, Specimen Preparation and Evaluation
    • Humidity and Temperature Testing
  • Environment Chamber: Humidity and temperature are the two factors that may have a negative impact on the assembly process. Thus, we tightly monitor and control these processes inside our facility to minimize their impact. We also take precautions to protect the sensitive electronic components on the printed circuit board from ESD (Electrostatic Discharge).

For more information about Accelerated Assemblies surface mount assembly services, please contact usat the earliest. Our experts are eager to help you with the right specifications, and value effective surface mount PCB assembly services.

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

6 layers AnylayerHDI, Halogen-free FR-4 TG150 Thick copper + thick gold inner and outer copper, HDI Printed Circuit Boar6 layers AnylayerHDI, Halogen-free FR-4 TG150 Thick copper + thick gold inner and outer copper, HDI Printed Circuit Boar

Titan PCB Lead Time (Days)

ItemsSampleHigh Volume
Single Sided PCB1-34-7
Double Sided PCB2-57-10
Multi-layer PCB7-810-15
PCB Making & Assembly8-1515-20

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