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Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: CMC111,CMC121,CMC131,CMC141,CMC13/74/13
Place of Origin: CHINA
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: copper/moly/copper
Density: 9.66
CTE: 6.8
TC: 190
MOQ: Negotiation
Price: Negotiable
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Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

Cu/Mo/Cu carrier Hermetic Packages Electronics Material CMC Flange


Description:


Cu/Mo/Cu(CMC) carrier, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.



Advantages:

1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity

Product Properties:

GradeDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
CMC1119.328.8305(XY)/250(Z)
CMC1219.547.8260(XY)/210(Z)
CMC1319.666.8244(XY)/190(Z)
CMC1419.756.0220(XY)/180(Z)
CMC13/74/139.885.6200(XY)/170(Z)

Application:

Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.


Product picture:



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