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High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin: CHINA
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: Molybdenum copper
Density: 9.66
CTE: 7.5
TC: 220
MOQ: Negotiation
Price: Negotiable
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High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

MOLYBDENUM COPPER FLANGE FOR HERMETIC PACKAGES ELECTRONICS RF DEVICE PACKAGE FLANGE


Description:


Molybdenum Copper composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.


Advantages:


1. This molybdenum copper flange feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flange is much lighter than comparable tungsten copper composite,so it is more suitable for aerospace and other field.


Product Properties:


GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu85±2%10.07160(25℃)/156(100℃)
70MoCu70±2%9.87200(25℃)/196(100℃)
60MoCu60±2%9.667.5222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

Application:


These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


Product picture:

Buy High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange at wholesale prices
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