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Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50WCu,75WCu,80WCu,85WCu,90WCu
Place of Origin: CHINA
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
MOQ: Negotiation
Price: Negotiable
Material: tungsten copper
Density: 12.2
CTE: 12.5
TC: 310
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Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount

Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount


Description:

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:

(1) Ceramic materials: Al2O3(A-90,A-95,A-99),BeO(B-95, B-99),AlN,etc.;
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs, AlGaAs etc.;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;


Advantages:

1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void

Product Properties:

GradeW ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu90±2%17.06.5180 (25℃) /176 (100℃)
85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
50WCu50±2%12.212.5340 (25℃) / 310 (100℃)



Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Product picture:

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