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Categories | Hermetic Packages Electronics |
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Brand Name: | JBNR |
Model Number: | 50WCu,75WCu,80WCu,85WCu,90WCu |
Place of Origin: | CHINA |
Payment Terms: | L/C, , T/T, Western Union |
Delivery Time: | 15days |
Packaging Details: | as customer required |
MOQ: | Negotiation |
Price: | Negotiable |
Material: | tungsten copper |
Density: | 12.2 |
CTE: | 12.5 |
TC: | 310 |
Gold Plated Tungsten Copper Heat Spreader , Microelectronic
Packaging Tungsten Copper Submount
Description:
(1) Ceramic materials: Al2O3(A-90,A-95,A-99),BeO(B-95,
B-99),AlN,etc.;
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs, AlGaAs
etc.;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
They are extensively used as thermal mounting plates, chip
carriers, tungsten copper flanges, and frames for RF, light
emitting diodes and detectors, laser diode packages like pulse,
single emitter, bars and complex carriers for optoelectronics
amplifiers, receivers, transmitters, tunable lasers, etc.
Product picture:
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