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Categories | Hermetic Packages Electronics |
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Brand Name: | JBNR |
Model Number: | 50WCu,75WCu,80WCu,85WCu,90WCu |
Certification: | ISO9001 |
Place of Origin: | CHINA |
MOQ: | Negotiation |
Price: | Negotiable |
Payment Terms: | L/C, , T/T, Western Union |
Delivery Time: | 15days |
Packaging Details: | as customer required |
Material: | tungsten copper |
Density: | 15.65 |
CTE: | 8.3 |
TC: | 190-200 |
Plating: | gold |
Application: | electronic packaging |
Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink
Description:
Copper Tungsten is one of the most popular refractory metal based
heat sink materials offered today. With the new off-the-shelf
system, we are able to offer standard products with a short
lead-time at extremely competitive rates.
Our heat sink are composites of tungsten and copper. By adjusting
the content of tungsten, we can have its coefficient of thermal
expansion (CTE) designed to match those of materials such as
ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar),
etc.
Advantages:
Good machinability
Good hermeticity
Good thermal conductivity
Good mechanical strength to provide excellent mechanical protection to the IC
Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
Product Properties:
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Application:
These composite are widely used in applications such as
Optoelectronics Packages, Microwave Packages, C Packages, Laser
Sub-mounts, etc.
Product picture:
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