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Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50WCu,75WCu,80WCu,85WCu,90WCu
Certification: ISO9001
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: tungsten copper
Density: 15.65
CTE: 8.3
TC: 190-200
Plating: gold
Application: electronic packaging
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    Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink


    Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink

    Description:

    Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.

    Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.

    Advantages:

    Good machinability

    Good hermeticity

    Good thermal conductivity

    Good mechanical strength to provide excellent mechanical protection to the IC

    Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    TypeCompositionProperties
    Tungsten ContentDensityCTEThermal Conductivity
    W90Cu90 ± 1 wt %17.0 g/cm36.5 ppm/K180 - 190 W/m.K
    W85Cu85 ± 1 wt %16.3 g/cm37.0 ppm/K190 - 200 W/m.K
    W80Cu80 ± 1 wt %15.6 g/cm38.3 ppm/K200 - 210 W/m.K
    W75Cu75 ± 1 wt %14.9 g/cm39.0 ppm/K220 - 230 W/m.K

    Application:


    These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


    Product picture:

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