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Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu
Certification: ISO9001
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 25days
Packaging Details: as customer required
Material: Molybdenum copper
Density: 10
CTE: 7
TC: 160-200
Plating: Nickel and gold
name: electronic packaging materials
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Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication


Molybdenum Copper Heat Sink For High Power RF, Microwave, Semiconductor Packaging, Optical Communication


Description:

Mo-Cu composite is similar with Tungsten-copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-cu.


Advantages:

1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


Product Properties:

GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu85±2%10.07160(25℃)/156(100℃)
70MoCu70±2%9.87200(25℃)/196(100℃)
60MoCu60±2%9.667.5222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

Application:

These composite are widely used in applications, such as optoelectronics packages Microwave Packages, C Packages, Laser Sub-mounts, etc


Product picture:

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