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Categories | Hermetic Packages Electronics |
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Brand Name: | JBNR |
Model Number: | CMC111,CMC121,CMC131,CMC141,CMC13/74/13 |
Place of Origin: | CHINA |
Payment Terms: | L/C, , T/T, Western Union |
Delivery Time: | 15days |
Packaging Details: | as customer required |
Material: | copper/moly/copper |
Density: | 9.75 |
CTE: | 6 |
TC: | 180-200 |
Plating: | Nickel and gold |
Application: | Microwave carriers |
Cu-Mo-Cu (CMC) Sandwich Heat Sink of Electronic Packing Materials
Description:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) |
CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) |
CMC131 | 9.66 | 6.8 | 244(XY)/190(Z) |
CMC141 | 9.75 | 6 | 220(XY)/180(Z) |
CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages.GaAs device mount.
Product picture:
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