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Categories | Hermetic Packages Electronics |
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Brand Name: | JBNR |
Model Number: | 50WCu,60WCu,70WCu,85WCu |
Place of Origin: | CHINA |
MOQ: | Negotiation |
Price: | Negotiable |
Payment Terms: | L/C, , T/T, Western Union |
Supply Ability: | 1000000pcs per month |
Delivery Time: | 25days |
Packaging Details: | as customer required |
Material: | tungsten copper |
Density: | 16.4 |
CTE: | 7.2 |
TC: | 180-190 |
Brand: | JBNR |
Application: | Electronic Packaging |
Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper
Molybdenum Electronic Packaging Materials
Description:
Copper Tungsten are composites of tungsten and copper. By adjusting
the content of tungsten, we can have its coefficient of thermal
expansion (CTE) designed to match those of materials such as
ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar),
etc.
Molybdenum copper alloy is a composite material of molybdenum and
copper which has adjustable coefficient of thermal expansion and
thermal conductivity. But the density of molybdenum copper is much
smaller than tungsten copper.Therefore, molybdenum copper alloy is
more suitable for aerospace and other fields.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Stampable sheets available
4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products
available
5. Low void
Product Properties:
Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Our products are widely used in applications such as heat sink,
heat spreader, shim, laser diode submount, substrates, base plate,
flange, chip carrier, optical bench, etc.
Product picture:
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